Gold plating is often used in electronics, to provide a corrosion-resistant electrically conductive layer.
A layer of a suitable barrier metal, usually nickel, is often deposited on the Copper substrate before the gold plating. The layer of Nickel provides mechanical backing for the Gold layer, improving its wear resistance. It also reduces the impact of pores present in the Gold layer. The Nickel layer when deposited < .000040” it eliminates Copper migration through the Gold layer and is also the bonding layer when soldered. We specialize in plating precision components with tolerances as tight as +/- .0002
Both the nickel and gold layers can be plated by Electrolytic or Electroless processes. There are many factors to consider in selection of either electrolytic or Electroless plating methods. These include what the deposit will be used for, configuration of the part, materials compatibility and cost of processing.